Ansys Redhawk-SC, Totem Multiphysics Signoff Platform Gets Certification for TSMC’s N3 and N4 Process Technologies

PITTSBURGH, PA, USA, Jun 16, 2021 – Ansys (NASDAQ: ANSS) achieved certification of its cutting-edge multiphysics signoff solutions for TSMC’s advanced N3 and N4 process technologies. This enables joint customers to meet critical power, thermal and reliability standards for highly sophisticated artificial intelligence/machine learning, 5G, high-performance computing (HPC), networking and autonomous vehicle chips.   TSMC workers in one […]