Ansys, TSMC Collaborate to Deliver Thermal Analysis Solution for 3D-IC Designs

PITTSBURGH, PA, USA, Oct 28, 2021 – TSMC and Ansys (NASDAQ: ANSS) collaborated to create a comprehensive thermal analysis solution for multi-die designs built with TSMC 3DFabric, TSMC’s comprehensive family of 3D silicon stacking and advanced packaging technologies. This solution is built on Ansys tools to simulate the temperature of 3D and 2.5D electronic systems containing multiple chips stacked closely […]