SPARC: a new deposition technology for advanced logic and DRAM

Electronic CAD

SPARC: a new deposition technology for advanced logic and DRAM

Chips are everywhere: from our mobile phones and automobiles to cloud servers for artificial intelligence, all of which seem to get faster, smarter, and better with each generation. Creating more powerful chips typically involves shrinking transistors and other components and packing them more closely together. As chip features become smaller, however, the incumbent materials may no longer achieve the same performance at the desired thickness and new materials may be needed.

The post SPARC: a new deposition technology for advanced logic and DRAM first appeared on Lam Research.

SPARC: a new deposition technology for advanced logic and DRAM

2022-06-17 07:06

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