Ansys and Intel Foundry partner on multiphysics analysis solution

Simulation software company Ansys and semiconductor manufacturer Intel Foundry have collaborated to offer multiphysics signoff solutions for Intel’s 2.5D chip assembly technology, which uses embedded multi-die interconnect bridge (EMIB) technology. The approach is designed to enable flexible die connections without requiring through-silicon vias (TSVs).

The partnership’s goal is to expand Ansys’ single-die system-on-chip (SoC) to include EMIB assembly technology.

Ansys says its simulation engines aim to ensure higher speeds, lower power consumption and enhanced reliability in advanced silicon systems for various applications such as artificial intelligence, high-performance computing, autonomous driving and graphics processing.

Continue reading Ansys and Intel Foundry partner on multiphysics analysis solution at Automotive Testing Technology International.